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ACHI IR3000 BGA rework station

  • Hong Kong Hong Kong  
  • Quantity Required: 1000
  • Last Updated:
    Posted on: 13 Oct 2020

RFQ Details

developed a dull red outside the BGA rework equipment. For CBGA, CCGA, CSP, QFN, MLF, PGA and all the green epoxy resins such as chip-level classes , BGA welding rework. Product design target is mainly notebooks, desktops, switches, XBOX and other game consoles, motherboards and graphics cards, etc. Communication BGA chip, shield and so on rework, weld area.

IR3000 through innovative design, an effective solution to the ordinary infrared rework station heating process is slow due to air flow caused by warming the biggest drawback. Demolition welding process takes about 3 minutes.
IR3000 can be very convenient without the need to connect a computer to operate. The upper and lower temperature range of independent heating, independent temperature measurement. Contact-type temperature probe can capture accurate, real-time temperature parameters of BGA heat. Temperature control is more comfortable. Welding is completed with alarm function.
IR3000-free hot air rework process flow. Does not affect the surrounding micro-components.
IR3000 large area can easily rework the upper part of heating a variety of CPU Block, various shielding enclosures, replacement of various components slot.
IR3000 can be planted directly heated chip BGA solder ball, the heating process of steel mesh is not deformed (suitable for direct heating, together with steel mesh to customers).
IR3000 can be done drying board and board shaping. Taiwan is trying to build a split-type BGA rework platform slide bracket. Can be very easily fixed PCB board, effectively prevent the deformation of PCB board. And function to meet the additional needs.